ZE-TECH PCBA Products
We offer the best PCB products
End-to-end electronics manufacturing solutions from component sourcing to final testing:
Full Process Control: SMT + THT + Testing + Packaging
Precision Assembly: 01005 Components | 0.3mm BGA | ±25μm Accuracy
Rigorous QC: AOI + X-Ray + Functional Testing (FCT)
Key Industries: Automotive, Medical, IoT, Industrial Automation
Certifications: ISO 13485, IATF 16949, IPC-A-610 Class 3
From Design to Delivery: Smarter, More Reliable Electronics Manufacturing
Layer :4
Board thickness: 1.6 mm
Material: FR4 TG170
Out layer copper thickness: 2 OZ
Inner layer copper thickness: 2 OZ
Surface treatment: Immersion gold 2U”
Minimum through hole: 0.2mm
Minimum line width/line spacing: 4.1 mil/ 3.8 mil
Application: Consumer electronics
Prodcut Type: OEM&ODM
PCB standard: IPC class 2
Layer :6
Board thickness: 2.6mm
Material: ITEQ 180
Out layer copper thickness: 3OZ
Inner layer copper thickness: 2 OZ
Surface treatment: ENEPIG
Minimum through hole: 0.25 mm
Minimum line width/line spacing: 4.2 mil/ 3.6 mil
Application: Consumer electronics
Prodcut Type: OEM&ODM
PCB standard: IPC class 3
Layer :12
Board thickness: 2.8mm
Material: Rogers 4350B
Out layer copper thickness: 5OZ
Inner layer copper thickness: 3 OZ
Surface treatment: Immersion Silver
Minimum through hole: 0.3mm
Minimum line width/line spacing: 3 mil/ 3.5 mil
Application: Communication
Prodcut Type: OEM&ODM
PCB standard: IPC class 3
Layer :28
Board thickness: 3.0 mm
Material: Taconic
Out layer copper thickness: 6 OZ
Inner layer copper thickness: 2 OZ
Surface treatment: ENIG
Minimum through hole: 0.15mm
Minimum line width/line spacing: 4.1mil/ 3.2 mil
Application: Automotive electronics
Prodcut Type: OEM&ODM
PCB standard: IPC class 2
Layer : 30
Board thickness: 2.2mm
Material: Arlon
Out layer copper thickness: 3OZ
Inner layer copper thickness: 1 OZ
Surface treatment: HASL LeadFree
Minimum Blind/ buried hole: 0.1mm/0.15 mm
Minimum line width/line spacing: 3.1 mil/ 3.6 mil
Application: Industrial control
Prodcut Type: OEM&ODM
PCB standard: IPC class 3
Layer : 36
Board thickness: 1.6 mm
Material: FR4 TG170
Out layer copper thickness: 5 OZ
Inner layer copper thickness: 8 OZ
Surface treatment: ENIG 3U’’
Minimum Blind/ buried hole: 0.15mm /0.1 mm
Minimum line width/line spacing: 3.3 mil/ 3.7 mil
Application: Medical devices
Prodcut Type: OEM&ODM
PCB standard: IPC class 3