ZE-TECH Rigid Flex PCB Products
Layer : 3
Board thickness: 2 mm
Material: FR4 TG170+Polyimide
Out layer copper thickness: 1 oz
Inner layer copper thickness: 1oz
Surface treatment: Immersion gold 3U”
Application: Consumer electronics
Minimum hole: 0.2 mm
Minimum line width/line spacing: 3.7mil/ 4.3 mil
Layer : 4
Board thickness: 1.2 mm
Material: FR4 +Polyimide
Out layer copper thickness: 3 OZ
Inner layer copper thickness: 1 OZ
Surface treatment: Immersion Gold
Minimum hole: 0.15 mm
Minimum line width/line spacing: 3.2mil/ 4.1 mil
Application: Industrial Control
Layer : 6
Board thickness: 2.6 mm
Material: ITEQ 180 +Polyimide
Out layer copper thickness: 2 OZ
Inner layer copper thickness: 3 OZ
Surface treatment: HASL lead free
Minimum Blind/Buried hole: 0.15 mm/0.1mm
Minimum line width/line spacing: 3mil/ 3.1 mil
Application: Automotive Electronics
Layer : 10
Board thickness: 1.6 mm
Material: Rogers 4350B +Polyimide
Out layer copper thickness: 2OZ
Inner layer copper thickness: 1 OZ
Surface treatment: Immersion Gold
Minimum hole: 0.2 mm
Minimum line width/line spacing: 3.1mil/ 3.3mil
Application: Computer Hardware
Layer : 16
Board thickness: 2.6 mm
Material: FR4 TG170 +Polyimide
Out layer copper thickness: 3OZ
Inner layer copper thickness: 1 OZ
Surface treatment: ENIG
Minimum Blind/ Buried hole: 0.1 mm/0.15mm
Minimum line width/line spacing: 3.2mil/ 3.6mil
Application: Communication
Layer : 26
Board thickness: 2 mm
Material: Arlon +Polyimide
Out layer copper thickness: 3OZ
Inner layer copper thickness: 2 OZ
Surface treatment: Immersion Tin
Minimum line width/line spacing: 3mil/ 3.7mil
Application: Aerospace